Uneven coating thickness can result in inconsistent performance and appearance of the product, affecting its quality. This is mainly due to the unreasonable distribution of the position of the workpiece in the electroplating tank, resulting in uneven current distribution in different parts; In addition, improper anode layout can also cause differences in coating thickness.
To solve the problem of uneven coating thickness, it is necessary to optimize the mounting method of the workpiece in the electroplating tank, ensure that the distance between each part of the workpiece and the anode is relatively uniform, and make the current distribution more even; Reasonably design the shape, quantity, and position of the anode to effectively cover the surface of the workpiece and provide uniform current distribution; And, during the electroplating process, it is necessary to regularly check and adjust the status of the anode to ensure its normal operation.
Pinholes and pockmarks are tiny defects on the surface of coatings, and their causes are complex. On the one hand, organic impurities in the plating solution will adsorb on the cathode surface under the action of an electric field, hindering the deposition of metal ions and forming pinholes; On the other hand, the precipitation of hydrogen on the cathode may also lead to the formation of pinholes. In addition, factors such as unstable plating solution composition and abnormal pH value may also cause pinholes and pitting.
To address this issue, the following measures can be taken: strengthen the maintenance and management of the plating solution, regularly detect and supplement the effective components in the plating solution, and maintain the purity of the plating solution; Add an appropriate amount of wetting agents and other additives to reduce the surface tension of the plating solution and minimize the adsorption of bubbles on the cathode surface; At the same time, control the pH value during the electroplating process to avoid pinholes and pitting caused by pH fluctuations.
In summary, common quality issues in electroplating processing involve multiple aspects such as rough coating, poor adhesion, uneven thickness, and pinholes and pitting. By analyzing the causes of these problems and taking corresponding solutions, such as purifying the plating solution, controlling process parameters, optimizing the mounting method, and strengthening plating solution management, the quality of electroplating processing can be effectively improved, high-quality coating products that meet the requirements can be produced, and the quality needs of various industries for electroplated parts can be met, promoting the continuous development and progress of electroplating processing technology.
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